EXTREME PERFORMANCE: Straight-fin design with twice the height of other heatsinks for extra heat dissipation performance whether actively or passively cooled. Mandatory for applications in high temperature, sealed, or overclocked applications.

LONG LASTING EXACT FIT: CPU and LAN chipset heatsinks are fabricated specifically for the Raspberry Pi 3 Model B+ and B. Double-sided 3M thermal transfer tape offers high thermal conductivity and long lasting adhesion in all mounting scenarios.

QUICK AND SIMPLE INSTALLATION: Peel and stick in the orientation with the most airflow. Most effective solution for reliable performance and longevity. No more messy thermal paste and compatible with LoveRPi Power over Ethernet HAT for Raspberry Pi 3 Model B+.

NO MORE THROTTLING: Reduce chip hot-spots and increase thermal dissipation surface area by 10x. For Raspberry Pi 3 Model B, cooling amplification for CPU die area is over 100x! Say goodbye to temperature based performance throttling and maintain consistent maximum performance.

MUST HAVE FOR RASPBERRY PI 3: At full load, BCM2837 SoC will reach 100°C. That is hot enough to boil water! Together with active cooling an active cooling case like the LoveRPi Active Cooling Media Center PC Case, the heatsink will keep temperatures below 20°C above ambient.